Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12130482 | Hydrophobic feature to control adhesive flow | Bassam M. Ziadeh, Jingyi Huang, Ziyin Lin, Vipul V. Mehta, Joseph Van Nausdle | 2024-10-29 |
| 12099245 | Completely encapsulated optical multi chip package | Asako Toda, Chia-Pin Chiu, Xiaoqian Li | 2024-09-24 |
| 12068222 | Dummy die structures of a packaged integrated circuit device | Mitul Modi, Joseph Van Nausdle, Omkar G. Karhade, Edvin Cetegen, Nicholas S. Haehn +4 more | 2024-08-20 |