Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087731 | No mold shelf package design and process flow for advanced package architectures | Wei Li, Edvin Cetegen, Ram Viswanath, Nicholas Neal, Mitul Modi | 2024-09-10 |
| 12068222 | Dummy die structures of a packaged integrated circuit device | Mitul Modi, Joseph Van Nausdle, Omkar G. Karhade, Edvin Cetegen, Vaibhav Agrawal +4 more | 2024-08-20 |
| 12009271 | Protruding SN substrate features for epoxy flow control | Edvin Cetegen, Jacob VEHONSKY, Thomas HEATON, Steve Cho, Rahul Jain +5 more | 2024-06-11 |
| 11942393 | Substrate with thermal insulation | Wei Li, Edvin Cetegen, Mitul Modi, Nicholas Neal | 2024-03-26 |
| 11901333 | No mold shelf package design and process flow for advanced package architectures | Wei Li, Edvin Cetegen, Ram Viswanath, Nicholas Neal, Mitul Modi | 2024-02-13 |