Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176268 | Open cavity bridge co-planar placement architectures and processes | Omkar G. Karhade, Digvijay A. Raorane, Sairam Agraharam, Nitin A. Deshpande, Manish Dubey +1 more | 2024-12-24 |
| 12087731 | No mold shelf package design and process flow for advanced package architectures | Wei Li, Edvin Cetegen, Nicholas S. Haehn, Ram Viswanath, Nicholas Neal | 2024-09-10 |
| 12068222 | Dummy die structures of a packaged integrated circuit device | Joseph Van Nausdle, Omkar G. Karhade, Edvin Cetegen, Nicholas S. Haehn, Vaibhav Agrawal +4 more | 2024-08-20 |
| 12040246 | Chip-scale package architectures containing a die back side metal and a solder thermal interface material | Susmriti Das Mahapatra, Malavarayan Sankarasubramanian, Shenavia S. Howell, John Harper | 2024-07-16 |
| 12027448 | Open cavity bridge power delivery architectures and processes | Omkar G. Karhade, Sairam Agraharam, Nitin A. Deshpande, Digvijay A. Raorane | 2024-07-02 |
| 11942393 | Substrate with thermal insulation | Wei Li, Edvin Cetegen, Nicholas S. Haehn, Nicholas Neal | 2024-03-26 |
| 11901333 | No mold shelf package design and process flow for advanced package architectures | Wei Li, Edvin Cetegen, Nicholas S. Haehn, Ram Viswanath, Nicholas Neal | 2024-02-13 |