Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040246 | Chip-scale package architectures containing a die back side metal and a solder thermal interface material | Susmriti Das Mahapatra, Malavarayan Sankarasubramanian, John Harper, Mitul Modi | 2024-07-16 |