Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183688 | Integrated circuit die package stiffeners of metal alloys having exceptionally high CTE | Valery Ouvarov-Bancalero, Malavarayan Sankarasubramanian, Patrick Nardi, Bamidele Daniel Falola, Ravi Siddappa +1 more | 2024-12-31 |
| 12040246 | Chip-scale package architectures containing a die back side metal and a solder thermal interface material | Susmriti Das Mahapatra, Malavarayan Sankarasubramanian, Shenavia S. Howell, Mitul Modi | 2024-07-16 |
| 11916003 | Varied ball ball-grid-array (BGA) packages | Xiao Lu, Jiongxin Lu, Christopher Combs, Alexander HUETTIS, Jieping Zhang +5 more | 2024-02-27 |