Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183688 | Integrated circuit die package stiffeners of metal alloys having exceptionally high CTE | Valery Ouvarov-Bancalero, John Harper, Malavarayan Sankarasubramanian, Patrick Nardi, Ravi Siddappa +1 more | 2024-12-31 |
| 12166004 | Solder thermal interface material (STIM) with dopant | Susmriti Das Mahapatra, Amitesh Saha, Peng Li | 2024-12-10 |