Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183688 | Integrated circuit die package stiffeners of metal alloys having exceptionally high CTE | John Harper, Malavarayan Sankarasubramanian, Patrick Nardi, Bamidele Daniel Falola, Ravi Siddappa +1 more | 2024-12-31 |