Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183688 | Integrated circuit die package stiffeners of metal alloys having exceptionally high CTE | Valery Ouvarov-Bancalero, John Harper, Patrick Nardi, Bamidele Daniel Falola, Ravi Siddappa +1 more | 2024-12-31 |
| 12040246 | Chip-scale package architectures containing a die back side metal and a solder thermal interface material | Susmriti Das Mahapatra, Shenavia S. Howell, John Harper, Mitul Modi | 2024-07-16 |
| 11887962 | Microelectronic structures including bridges | Omkar G. Karhade, Nitin A. Deshpande, Mohit Bhatia, Sairam Agraharam, Edvin Cetegen +6 more | 2024-01-30 |