Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166004 | Solder thermal interface material (STIM) with dopant | Bamidele Daniel Falola, Amitesh Saha, Peng Li | 2024-12-10 |
| 12040246 | Chip-scale package architectures containing a die back side metal and a solder thermal interface material | Malavarayan Sankarasubramanian, Shenavia S. Howell, John Harper, Mitul Modi | 2024-07-16 |