Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166004 | Solder thermal interface material (STIM) with dopant | Susmriti Das Mahapatra, Bamidele Daniel Falola, Peng Li | 2024-12-10 |
| 12062592 | Integrated circuit packages with thermal interface materials with different material compositions | Sergio Antonio Chan Arguedas, Marco Aurelio Cartas, Ken Hackenberg, Emilio Tarango Valles | 2024-08-13 |