Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080620 | Additively manufactured structures for heat dissipation from integrated circuit devices | Feras Eid, Xavier Francois Brun, Paul Diglio, Joe Walczyk | 2024-09-03 |
| 12062592 | Integrated circuit packages with thermal interface materials with different material compositions | Amitesh Saha, Marco Aurelio Cartas, Ken Hackenberg, Emilio Tarango Valles | 2024-08-13 |
| 12009271 | Protruding SN substrate features for epoxy flow control | Edvin Cetegen, Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho +5 more | 2024-06-11 |
| 11935799 | Integrated circuit package lids with polymer features | Elah Bozorg-Grayeli, Taylor Gaines, Frederick Atadana, Robert F. Cheney | 2024-03-19 |
| 11894282 | Vented lids for integrated circuit packages | Zhimin Wan, Peng Li, Chandra Mohan Jha, Aravindha R. Antoniswamy, Cheng Xu +2 more | 2024-02-06 |
| 11881438 | First-level integration of second-level thermal interface material for integrated circuit assemblies | Elah Bozorg-Grayeli, Kyle Arrington, Aravindha R. Antoniswamy | 2024-01-23 |