Issued Patents 2024
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170244 | High-throughput additively manufactured power delivery vias and traces | Adel A. Elsherbini, Georgios Dogiamis, Henning Braunisch, Beomseok Choi, William J. Lambert +3 more | 2024-12-17 |
| 12165962 | Hermetic sealing structures in microelectronic assemblies having direct bonding | Aleksandar Aleksov, Mohammad Enamul Kabir, Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan | 2024-12-10 |
| 12155372 | Multi-filter die | Georgios Dogiamis, Aleksandar Aleksov, Telesphor Kamgaing, Johanna M. Swan | 2024-11-26 |
| 12155133 | Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems | Sasha N. Oster, Telesphor Kamgaing, Georgios Dogiamis, Aleksandar Aleksov | 2024-11-26 |
| 12142510 | Carrier for microelectronic assemblies having direct bonding | Shawna M. Liff, Johanna M. Swan, Adel A. Elsherbini, Michael Baker, Aleksandar Aleksov | 2024-11-12 |
| 12142543 | Thermal management solutions for embedded integrated circuit devices | Johanna M. Swan, Adel A. Elsherbini | 2024-11-12 |
| 12136577 | Integrated circuit die packages including a contiguous heat spreader | Joe Walczyk, Paul Diglio | 2024-11-05 |
| 12113048 | Microelectronic assemblies | Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff | 2024-10-08 |
| 12107060 | Microelectronic assemblies with inductors in direct bonding regions | Adel A. Elsherbini, Zhiguo Qian, Gerald Pasdast, Mohammad Enamul Kabir, Han Wui Then +5 more | 2024-10-01 |
| 12087682 | Power delivery structures | Adel A. Elsherbini, Georgios Dogiamis, Beomseok Choi, Henning Braunisch, William J. Lambert +2 more | 2024-09-10 |
| 12080620 | Additively manufactured structures for heat dissipation from integrated circuit devices | Xavier Francois Brun, Paul Diglio, Joe Walczyk, Sergio Antonio Chan Arguedas | 2024-09-03 |
| 12062631 | Microelectronic assemblies with inductors in direct bonding regions | Adel A. Elsherbini, Krishna Bharath, Kevin P. O'Brien, Kimin Jun, Han Wui Then +5 more | 2024-08-13 |
| 12057402 | Direct bonding in microelectronic assemblies | Aleksandar Aleksov, Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan, Randy B. Osborne +1 more | 2024-08-06 |
| 12040776 | Integrated radio frequency (RF) front-end module (FEM) | Telesphor Kamgaing, Aleksandar Aleksov, Georgios Dogiamis, Johanna M. Swan | 2024-07-16 |
| 12040307 | Magnetic induced heating for solder interconnects | Adel A. Elsherbini, Georgios Dogiamis | 2024-07-16 |
| 12033914 | Package with thermal interface material retaining structures on die and heat spreader | — | 2024-07-09 |
| 12007170 | Thermal management in integrated circuit packages | Telesphor Kamgaing, Georgios Dogiamis, Aleksandar Aleksov, Johanna M. Swan | 2024-06-11 |
| 12002745 | High performance integrated RF passives using dual lithography process | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, William J. Lambert, Robert L. Sankman +6 more | 2024-06-04 |
| 11990448 | Direct bonding in microelectronic assemblies | Adel A. Elsherbini, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan | 2024-05-21 |
| 11990419 | Physically unclonable function circuitry of a package substrate and method of providing same | Georgios Dogiamis, Adel A. Elsherbini, David Johnston, Jyothi Bhaskarr Velamala, Rachael Parker | 2024-05-21 |
| 11948906 | Hybrid backside thermal structures for enhanced IC packages | Joe Walczyk, Weihua Tang, Akhilesh Rallabandi, Marco Aurelio Cartas Ayala | 2024-04-02 |
| 11933555 | Heat dissipation device having anisotropic thermally conductive sections and isotropic thermally conductive sections | Adel A. Elsherbini, Johanna M. Swan | 2024-03-19 |
| 11895815 | Additive manufacturing for integrated circuit assembly cables | Georgios Dogiamis, Adel A. Elsherbini | 2024-02-06 |
| 11887944 | Additive manufacturing for integrated circuit assembly connectors | Georgios Dogiamis, Adel A. Elsherbini | 2024-01-30 |