| 12170244 |
High-throughput additively manufactured power delivery vias and traces |
Adel A. Elsherbini, Georgios Dogiamis, Henning Braunisch, Beomseok Choi, William J. Lambert +3 more |
2024-12-17 |
$33,648,000 |
| 12165962 |
Hermetic sealing structures in microelectronic assemblies having direct bonding |
Aleksandar Aleksov, Mohammad Enamul Kabir, Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan |
2024-12-10 |
$13,394,000 |
| 12155372 |
Multi-filter die |
Georgios Dogiamis, Aleksandar Aleksov, Telesphor Kamgaing, Johanna M. Swan |
2024-11-26 |
$26,820,000 |
| 12155133 |
Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems |
Sasha N. Oster, Telesphor Kamgaing, Georgios Dogiamis, Aleksandar Aleksov |
2024-11-26 |
$26,820,000 |
| 12142510 |
Carrier for microelectronic assemblies having direct bonding |
Shawna M. Liff, Johanna M. Swan, Adel A. Elsherbini, Michael Baker, Aleksandar Aleksov |
2024-11-12 |
$28,491,000 |
| 12142543 |
Thermal management solutions for embedded integrated circuit devices |
Johanna M. Swan, Adel A. Elsherbini |
2024-11-12 |
$28,491,000 |
| 12136577 |
Integrated circuit die packages including a contiguous heat spreader |
Joe Walczyk, Paul Diglio |
2024-11-05 |
$48,202,000 |
| 12113048 |
Microelectronic assemblies |
Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff |
2024-10-08 |
$19,971,000 |
| 12107060 |
Microelectronic assemblies with inductors in direct bonding regions |
Adel A. Elsherbini, Zhiguo Qian, Gerald Pasdast, Mohammad Enamul Kabir, Han Wui Then +5 more |
2024-10-01 |
$20,560,000 |
| 12087682 |
Power delivery structures |
Adel A. Elsherbini, Georgios Dogiamis, Beomseok Choi, Henning Braunisch, William J. Lambert +2 more |
2024-09-10 |
$16,964,000 |
| 12080620 |
Additively manufactured structures for heat dissipation from integrated circuit devices |
Xavier Francois Brun, Paul Diglio, Joe Walczyk, Sergio Antonio Chan Arguedas |
2024-09-03 |
$14,017,000 |
| 12062631 |
Microelectronic assemblies with inductors in direct bonding regions |
Adel A. Elsherbini, Krishna Bharath, Kevin P. O'Brien, Kimin Jun, Han Wui Then +5 more |
2024-08-13 |
$26,861,000 |
| 12057402 |
Direct bonding in microelectronic assemblies |
Aleksandar Aleksov, Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan, Randy B. Osborne +1 more |
2024-08-06 |
$17,070,000 |
| 12040776 |
Integrated radio frequency (RF) front-end module (FEM) |
Telesphor Kamgaing, Aleksandar Aleksov, Georgios Dogiamis, Johanna M. Swan |
2024-07-16 |
$26,089,000 |
| 12040307 |
Magnetic induced heating for solder interconnects |
Adel A. Elsherbini, Georgios Dogiamis |
2024-07-16 |
$26,089,000 |
| 12033914 |
Package with thermal interface material retaining structures on die and heat spreader |
— |
2024-07-09 |
$24,938,000 |
| 12007170 |
Thermal management in integrated circuit packages |
Telesphor Kamgaing, Georgios Dogiamis, Aleksandar Aleksov, Johanna M. Swan |
2024-06-11 |
$21,221,000 |
| 12002745 |
High performance integrated RF passives using dual lithography process |
Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, William J. Lambert, Robert L. Sankman +6 more |
2024-06-04 |
$24,500,000 |
| 11990448 |
Direct bonding in microelectronic assemblies |
Adel A. Elsherbini, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan |
2024-05-21 |
$18,840,000 |
| 11990419 |
Physically unclonable function circuitry of a package substrate and method of providing same |
Georgios Dogiamis, Adel A. Elsherbini, David Johnston, Jyothi Bhaskarr Velamala, Rachael Parker |
2024-05-21 |
$18,840,000 |
| 11948906 |
Hybrid backside thermal structures for enhanced IC packages |
Joe Walczyk, Weihua Tang, Akhilesh Rallabandi, Marco Aurelio Cartas Ayala |
2024-04-02 |
$34,819,000 |
| 11933555 |
Heat dissipation device having anisotropic thermally conductive sections and isotropic thermally conductive sections |
Adel A. Elsherbini, Johanna M. Swan |
2024-03-19 |
$28,784,000 |
| 11895815 |
Additive manufacturing for integrated circuit assembly cables |
Georgios Dogiamis, Adel A. Elsherbini |
2024-02-06 |
$35,892,000 |
| 11887944 |
Additive manufacturing for integrated circuit assembly connectors |
Georgios Dogiamis, Adel A. Elsherbini |
2024-01-30 |
$30,721,000 |
