| 12176323 |
Microelectronic assemblies |
Adel A. Elsherbini, Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan +3 more |
2024-12-24 |
| 12107060 |
Microelectronic assemblies with inductors in direct bonding regions |
Adel A. Elsherbini, Zhiguo Qian, Gerald Pasdast, Mohammad Enamul Kabir, Han Wui Then +5 more |
2024-10-01 |
| 12100761 |
Wrap-around source/drain method of making contacts for backside metals |
Patrick Morrow, Il-Seok Son, Donald W. Nelson |
2024-09-24 |
| 12100762 |
Wrap-around source/drain method of making contacts for backside metals |
Patrick Morrow, Il-Seok Son, Donald W. Nelson |
2024-09-24 |
| 12062631 |
Microelectronic assemblies with inductors in direct bonding regions |
Adel A. Elsherbini, Krishna Bharath, Kevin P. O'Brien, Han Wui Then, Mohammad Enamul Kabir +5 more |
2024-08-13 |
| 11996404 |
Three-dimensional integrated circuits (3DICs) including bottom gate MOS transistors with monocrystalline channel material |
Cheng-Ying Huang, Gilbert Dewey, Ashish Agrawal, Willy Rachmady, Zachary Geiger +5 more |
2024-05-28 |
| 11935933 |
Backside contact structures and fabrication for metal on both sides of devices |
Patrick Morrow, Rishabh Mehandru, Aaron D. Lilak |
2024-03-19 |
| 11869894 |
Metallization structures for stacked device connectivity and their methods of fabrication |
Aaron D. Lilak, Anh Phan, Patrick Morrow, Willy Rachmady, Gilbert Dewey +6 more |
2024-01-09 |