Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176323 | Microelectronic assemblies | Adel A. Elsherbini, Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan +3 more | 2024-12-24 |
| 12107060 | Microelectronic assemblies with inductors in direct bonding regions | Adel A. Elsherbini, Zhiguo Qian, Gerald Pasdast, Mohammad Enamul Kabir, Han Wui Then +5 more | 2024-10-01 |
| 12100761 | Wrap-around source/drain method of making contacts for backside metals | Patrick Morrow, Il-Seok Son, Donald W. Nelson | 2024-09-24 |
| 12100762 | Wrap-around source/drain method of making contacts for backside metals | Patrick Morrow, Il-Seok Son, Donald W. Nelson | 2024-09-24 |
| 12062631 | Microelectronic assemblies with inductors in direct bonding regions | Adel A. Elsherbini, Krishna Bharath, Kevin P. O'Brien, Han Wui Then, Mohammad Enamul Kabir +5 more | 2024-08-13 |
| 11996404 | Three-dimensional integrated circuits (3DICs) including bottom gate MOS transistors with monocrystalline channel material | Cheng-Ying Huang, Gilbert Dewey, Ashish Agrawal, Willy Rachmady, Zachary Geiger +5 more | 2024-05-28 |
| 11935933 | Backside contact structures and fabrication for metal on both sides of devices | Patrick Morrow, Rishabh Mehandru, Aaron D. Lilak | 2024-03-19 |
| 11869894 | Metallization structures for stacked device connectivity and their methods of fabrication | Aaron D. Lilak, Anh Phan, Patrick Morrow, Willy Rachmady, Gilbert Dewey +6 more | 2024-01-09 |