Kimin Jun — 8 Patents at Intel

Issued Patents 2024

Showing 1–8 of 8 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12176323	Microelectronic assemblies	Adel A. Elsherbini, Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan +3 more	2024-12-24	$17,261,000
12107060	Microelectronic assemblies with inductors in direct bonding regions	Adel A. Elsherbini, Zhiguo Qian, Gerald Pasdast, Mohammad Enamul Kabir, Han Wui Then +5 more	2024-10-01	$20,560,000
12100761	Wrap-around source/drain method of making contacts for backside metals	Patrick Morrow, Il-Seok Son, Donald W. Nelson	2024-09-24	$33,787,000
12100762	Wrap-around source/drain method of making contacts for backside metals	Patrick Morrow, Il-Seok Son, Donald W. Nelson	2024-09-24	$33,787,000
12062631	Microelectronic assemblies with inductors in direct bonding regions	Adel A. Elsherbini, Krishna Bharath, Kevin P. O'Brien, Han Wui Then, Mohammad Enamul Kabir +5 more	2024-08-13	$26,861,000
11996404	Three-dimensional integrated circuits (3DICs) including bottom gate MOS transistors with monocrystalline channel material	Cheng-Ying Huang, Gilbert Dewey, Ashish Agrawal, Willy Rachmady, Zachary Geiger +5 more	2024-05-28	$30,739,000
11935933	Backside contact structures and fabrication for metal on both sides of devices	Patrick Morrow, Rishabh Mehandru, Aaron D. Lilak	2024-03-19	$28,784,000
11869894	Metallization structures for stacked device connectivity and their methods of fabrication	Aaron D. Lilak, Anh Phan, Patrick Morrow, Willy Rachmady, Gilbert Dewey +6 more	2024-01-09	$30,329,000