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Scalable and interoperable PHYLESS die-to-die IO solution |
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| 12125777 |
Minimizing package impedance discontinuity through dielectric structure optimizations |
Gang Duan, Kemal Aygun, Jieying Kong, Brandon C. Marin |
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| 12107060 |
Microelectronic assemblies with inductors in direct bonding regions |
Adel A. Elsherbini, Gerald Pasdast, Mohammad Enamul Kabir, Han Wui Then, Kimin Jun +5 more |
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| 12100662 |
Power-forwarding bridge for inter-chip data signal transfer |
Gerald Pasdast, Peipei Wang, Daniel Scott Krueger, Edward A. Burton |
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| 12062616 |
Power delivery for embedded bridge die utilizing trench structures |
Kemal Aygun, Jianyong Xie |
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| 12033930 |
Selectively roughened copper architectures for low insertion loss conductive features |
Jieying Kong, Yiyang Zhou, Suddhasattwa Nad, Jeremy Ecton, Hongxia Feng +9 more |
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| 12009320 |
Interconnect loss of high density package with magnetic material |
Cemil Geyik, Jiwei Sun, Gang Duan, Kemal Aygun |
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| 11984439 |
Microelectronic assemblies |
Adel A. Elsherbini, Georgios Dogiamis, Shawna M. Liff, Johanna M. Swan |
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| 11923308 |
Die interconnect structures having bump field and ground plane |
Kemal Aygun |
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| 11901280 |
Ground via clustering for crosstalk mitigation |
Kemal Aygun, Yu Zhang |
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| 11887932 |
Dielectric-filled trench isolation of vias |
Kemal Aygun, Jianyong Xie |
2024-01-30 |