Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125777 | Minimizing package impedance discontinuity through dielectric structure optimizations | Zhiguo Qian, Gang Duan, Kemal Aygun, Jieying Kong | 2024-10-22 |
| 12074102 | Structural elements for application specific electronic device packages | Suddhasattwa Nad, Ravindranath V. Mahajan, Jeremy Ecton, Mohammad Mamunur Rahman | 2024-08-27 |
| 12057252 | Electronic substrates having embedded inductors | Benjamin Duong, Michael Garelick, Darko Grujicic, Tarek A. Ibrahim, Sai Vadlamani +1 more | 2024-08-06 |
| 12033930 | Selectively roughened copper architectures for low insertion loss conductive features | Jieying Kong, Yiyang Zhou, Suddhasattwa Nad, Jeremy Ecton, Hongxia Feng +9 more | 2024-07-09 |
| 12027466 | Conductive route patterning for electronic substrates | Jeremy Ecton, Aleksandar Aleksov, Yonggang Li, Leonel Arana, Suddhasattwa Nad +2 more | 2024-07-02 |
| 11948848 | Subtractive etch resolution implementing a functional thin metal resist | Jeremy Ecton, Oscar Ojeda, Leonel Arana, Suddhasattwa Nad, Robert Alan May +1 more | 2024-04-02 |