Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159825 | Dielectric-to-metal adhesion promotion material | Rahul N. Manepalli, Suddhasattwa Nad, Marcel Wall | 2024-12-03 |
| 12159844 | Electronic substrates having embedded inductors | Benjamin Duong, Roy Dittler, Chandrasekharan Nair, Rengarajan Shanmugam | 2024-12-03 |
| 12057252 | Electronic substrates having embedded inductors | Benjamin Duong, Michael Garelick, Tarek A. Ibrahim, Brandon C. Marin, Sai Vadlamani +1 more | 2024-08-06 |