| 12181710 |
Photonic integrated circuit packaging architecture |
Omkar G. Karhade, Xiaoqian Li, Ravindranath V. Mahajan, Nitin A. Deshpande |
2024-12-31 |
| 12176292 |
Microelectronic component having molded regions with through-mold vias |
Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Jason M. Gamba, Manish Dubey +1 more |
2024-12-24 |
| 12068172 |
Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB packages |
Rahul N. Manepalli, Wei-Lun Kane Jen, Steve Cho, Jason M. Gamba, Javier Soto Gonzalez |
2024-08-20 |
| 12057252 |
Electronic substrates having embedded inductors |
Benjamin Duong, Michael Garelick, Darko Grujicic, Brandon C. Marin, Sai Vadlamani +1 more |
2024-08-06 |
| 12033930 |
Selectively roughened copper architectures for low insertion loss conductive features |
Jieying Kong, Yiyang Zhou, Suddhasattwa Nad, Jeremy Ecton, Hongxia Feng +9 more |
2024-07-09 |
| 12027466 |
Conductive route patterning for electronic substrates |
Jeremy Ecton, Aleksandar Aleksov, Brandon C. Marin, Yonggang Li, Leonel Arana +2 more |
2024-07-02 |
| 12009271 |
Protruding SN substrate features for epoxy flow control |
Edvin Cetegen, Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho +5 more |
2024-06-11 |
| 11923307 |
Microelectronic structures including bridges |
Bai Nie, Gang Duan, Omkar G. Karhade, Nitin A. Deshpande, Yikang Deng +6 more |
2024-03-05 |