Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12181710 | Photonic integrated circuit packaging architecture | Omkar G. Karhade, Xiaoqian Li, Ravindranath V. Mahajan, Nitin A. Deshpande | 2024-12-31 |
| 12176292 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Jason M. Gamba, Manish Dubey +1 more | 2024-12-24 |
| 12068172 | Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB packages | Rahul N. Manepalli, Wei-Lun Kane Jen, Steve Cho, Jason M. Gamba, Javier Soto Gonzalez | 2024-08-20 |
| 12057252 | Electronic substrates having embedded inductors | Benjamin Duong, Michael Garelick, Darko Grujicic, Brandon C. Marin, Sai Vadlamani +1 more | 2024-08-06 |
| 12033930 | Selectively roughened copper architectures for low insertion loss conductive features | Jieying Kong, Yiyang Zhou, Suddhasattwa Nad, Jeremy Ecton, Hongxia Feng +9 more | 2024-07-09 |
| 12027466 | Conductive route patterning for electronic substrates | Jeremy Ecton, Aleksandar Aleksov, Brandon C. Marin, Yonggang Li, Leonel Arana +2 more | 2024-07-02 |
| 12009271 | Protruding SN substrate features for epoxy flow control | Edvin Cetegen, Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho +5 more | 2024-06-11 |
| 11923307 | Microelectronic structures including bridges | Bai Nie, Gang Duan, Omkar G. Karhade, Nitin A. Deshpande, Yikang Deng +6 more | 2024-03-05 |