Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176292 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Manish Dubey +1 more | 2024-12-24 |
| 12068172 | Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB packages | Tarek A. Ibrahim, Rahul N. Manepalli, Wei-Lun Kane Jen, Steve Cho, Javier Soto Gonzalez | 2024-08-20 |