Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12068172 | Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB packages | Tarek A. Ibrahim, Rahul N. Manepalli, Wei-Lun Kane Jen, Jason M. Gamba, Javier Soto Gonzalez | 2024-08-20 | $20,163,000 |
| 12009271 | Protruding SN substrate features for epoxy flow control | Edvin Cetegen, Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Rahul Jain +5 more | 2024-06-11 | $21,221,000 |
| 11935857 | Surface finishes with low RBTV for fine and mixed bump pitch architectures | Kristof Darmawaikarta, Robert Alan May, Sashi S. Kandanur, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram +7 more | 2024-03-19 | $28,784,000 |