Issued Patents 2024
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176223 | Integrated circuit package supports | Kristof Darmawikarta, Robert Alan May, Sri Ranga Sai Boyapati, Chung Kwang Christopher Tan, Aleksandar Aleksov | 2024-12-24 |
| 12165994 | Radio frequency antennas and waveguides for communication between integrated circuit devices | Aleksandar Aleksov, Kristof Darmawikarta, Benjamin Duong, Telesphor Kamgaing, Miranda Ngan | 2024-12-10 |
| 12148704 | Electrical interconnect bridge | Rahul N. Manepalli | 2024-11-19 |
| 12125793 | Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications | Rahul N. Manepalli, Gang Duan | 2024-10-22 |
| 12087700 | Embedded die microelectronic device with molded component | Rahul N. Manepalli, Praneeth Akkinepally, Jesse C. Jones, Yosuke Kanaoka, Dilan Seneviratne | 2024-09-10 |
| 12087695 | Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications | Rahul N. Manepalli, Gang Duan | 2024-09-10 |
| 11990427 | Chiplet first architecture for die tiling applications | Gang Duan, Deepak Kulkarni, Rahul N. Manepalli, Xiaoying Guo | 2024-05-21 |
| 11978685 | Glass core patch with in situ fabricated fan-out layer to enable die tiling applications | Robert L. Sankman, Rahul N. Manepalli, Gang Duan, Debendra Mallik | 2024-05-07 |
| 11973041 | Chiplet first architecture for die tiling applications | Gang Duan, Deepak Kulkarni, Rahul N. Manepalli, Xiaoying Guo | 2024-04-30 |
| 11948898 | Etch barrier for microelectronic packaging conductive structures | Kristof Darmawikarta, Hongxia Feng, Xiaoying Guo, Benjamin Duong | 2024-04-02 |
| 11935857 | Surface finishes with low RBTV for fine and mixed bump pitch architectures | Kristof Darmawaikarta, Robert Alan May, Sashi S. Kandanur, Sri Ranga Sai Boyapati, Steve Cho +7 more | 2024-03-19 |
| 11929212 | Method to form high capacitance thin film capacitors (TFCs) as embedded passives in organic substrate packages | Sameer Paital, Gang Duan, Kristof Darmawikarta | 2024-03-12 |
| 11923312 | Patternable die attach materials and processes for patterning | Bai Nie, Gang Duan, Jesse C. Jones, Yosuke Kanaoka, Hongxia Feng +10 more | 2024-03-05 |
| 11901248 | Embedded die architecture and method of making | Robert L. Sankman, Rahul N. Manepalli, Robert Alan May, Bharat P. Penmecha | 2024-02-13 |
| 11862619 | Patch accommodating embedded dies having different thicknesses | Robert Alan May, Kristof Darmawikarta, Hiroki Tanaka, Rahul N. Manepalli, Sri Ranga Sai Boyapati | 2024-01-02 |