Issued Patents 2024
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183961 | Methods for conductively coating millimeter waveguides | Georgios Dogiamis, Telesphor Kamgaing, Sasha N. Oster, Adel A. Elsherbini, Shawna M. Liff +3 more | 2024-12-31 |
| 12176323 | Microelectronic assemblies | Adel A. Elsherbini, Henning Braunisch, Shawna M. Liff, Johanna M. Swan, Patrick Morrow +3 more | 2024-12-24 |
| 12176223 | Integrated circuit package supports | Kristof Darmawikarta, Robert Alan May, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram, Chung Kwang Christopher Tan | 2024-12-24 |
| 12165994 | Radio frequency antennas and waveguides for communication between integrated circuit devices | Kristof Darmawikarta, Benjamin Duong, Telesphor Kamgaing, Miranda Ngan, Srinivas V. Pietambaram | 2024-12-10 |
| 12165962 | Hermetic sealing structures in microelectronic assemblies having direct bonding | Mohammad Enamul Kabir, Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan, Feras Eid | 2024-12-10 |
| 12155133 | Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems | Feras Eid, Sasha N. Oster, Telesphor Kamgaing, Georgios Dogiamis | 2024-11-26 |
| 12155372 | Multi-filter die | Georgios Dogiamis, Feras Eid, Telesphor Kamgaing, Johanna M. Swan | 2024-11-26 |
| 12150271 | Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device | Telesphor Kamgaing, Johanna M. Swan, Georgios Dogiamis, Henning Braunisch, Adel A. Elsherbini +1 more | 2024-11-19 |
| 12142510 | Carrier for microelectronic assemblies having direct bonding | Shawna M. Liff, Johanna M. Swan, Adel A. Elsherbini, Michael Baker, Feras Eid | 2024-11-12 |
| 12136596 | Microelectronic assemblies | Johanna M. Swan | 2024-11-05 |
| 12113026 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more | 2024-10-08 |
| 12107060 | Microelectronic assemblies with inductors in direct bonding regions | Adel A. Elsherbini, Zhiguo Qian, Gerald Pasdast, Mohammad Enamul Kabir, Han Wui Then +5 more | 2024-10-01 |
| 12062631 | Microelectronic assemblies with inductors in direct bonding regions | Adel A. Elsherbini, Krishna Bharath, Kevin P. O'Brien, Kimin Jun, Han Wui Then +5 more | 2024-08-13 |
| 12057402 | Direct bonding in microelectronic assemblies | Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan, Feras Eid, Randy B. Osborne +1 more | 2024-08-06 |
| 12040776 | Integrated radio frequency (RF) front-end module (FEM) | Telesphor Kamgaing, Feras Eid, Georgios Dogiamis, Johanna M. Swan | 2024-07-16 |
| 12027466 | Conductive route patterning for electronic substrates | Jeremy Ecton, Brandon C. Marin, Yonggang Li, Leonel Arana, Suddhasattwa Nad +2 more | 2024-07-02 |
| 12007170 | Thermal management in integrated circuit packages | Feras Eid, Telesphor Kamgaing, Georgios Dogiamis, Johanna M. Swan | 2024-06-11 |
| 12002745 | High performance integrated RF passives using dual lithography process | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, William J. Lambert, Robert L. Sankman +6 more | 2024-06-04 |
| 11990448 | Direct bonding in microelectronic assemblies | Feras Eid, Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan | 2024-05-21 |
| 11942334 | Microelectronic assemblies having conductive structures with different thicknesses | Jeremy Ecton, Suddhasattwa Nad, Kristof Darmawikarta, Vahidreza Parichehreh, Veronica Strong +1 more | 2024-03-26 |
| 11935857 | Surface finishes with low RBTV for fine and mixed bump pitch architectures | Kristof Darmawaikarta, Robert Alan May, Sashi S. Kandanur, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram +7 more | 2024-03-19 |
| 11908802 | Multi-chip package with high density interconnects | Adel A. Elsherbini, Kristof Darmawikarta, Robert Alan May, Sri Ranga Sai Boyapati | 2024-02-20 |
| 11894324 | In-package RF waveguides as high bandwidth chip-to-chip interconnects and methods for using the same | Telesphor Kamgaing, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Eyal Fayneh, Ofir Degani +2 more | 2024-02-06 |
| 11876053 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more | 2024-01-16 |