Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12123908 | Loopback testing of integrated circuits | Guy REDLER, Shai Cohen, Evelyn Landman | 2024-10-22 |
| 12092684 | Integrated circuit workload, temperature, and/or sub-threshold leakage sensor | Inbar WEINTROB, Evelyn Landman, Yahel DAVID, Shai Cohen, Guy REDLER | 2024-09-17 |
| 12072376 | Die-to-die connectivity monitoring | Guy REDLER, Evelyn Landman, Ishai Zeev COHEN, Shaked Rahamim, Alex KHAZIN | 2024-08-27 |
| 12013800 | Die-to-die and chip-to-chip connectivity monitoring | Guy REDLER, Evelyn Landman | 2024-06-18 |
| 11929131 | Memory device degradation monitoring | Guy REDLER, Evelyn Landman | 2024-03-12 |
| 11894324 | In-package RF waveguides as high bandwidth chip-to-chip interconnects and methods for using the same | Aleksandar Aleksov, Telesphor Kamgaing, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Ofir Degani +2 more | 2024-02-06 |