Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11942334 | Microelectronic assemblies having conductive structures with different thicknesses | Jeremy Ecton, Aleksandar Aleksov, Suddhasattwa Nad, Kristof Darmawikarta, Veronica Strong +1 more | 2024-03-26 |