Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12074102 | Structural elements for application specific electronic device packages | Suddhasattwa Nad, Ravindranath V. Mahajan, Brandon C. Marin, Mohammad Mamunur Rahman | 2024-08-27 |
| 12033930 | Selectively roughened copper architectures for low insertion loss conductive features | Jieying Kong, Yiyang Zhou, Suddhasattwa Nad, Hongxia Feng, Tarek A. Ibrahim +9 more | 2024-07-09 |
| 12027466 | Conductive route patterning for electronic substrates | Aleksandar Aleksov, Brandon C. Marin, Yonggang Li, Leonel Arana, Suddhasattwa Nad +2 more | 2024-07-02 |
| 11948848 | Subtractive etch resolution implementing a functional thin metal resist | Oscar Ojeda, Leonel Arana, Suddhasattwa Nad, Robert Alan May, Hiroki Tanaka +1 more | 2024-04-02 |
| 11942334 | Microelectronic assemblies having conductive structures with different thicknesses | Aleksandar Aleksov, Suddhasattwa Nad, Kristof Darmawikarta, Vahidreza Parichehreh, Veronica Strong +1 more | 2024-03-26 |