Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125777 | Minimizing package impedance discontinuity through dielectric structure optimizations | Zhiguo Qian, Gang Duan, Kemal Aygun, Brandon C. Marin | 2024-10-22 |
| 12033930 | Selectively roughened copper architectures for low insertion loss conductive features | Yiyang Zhou, Suddhasattwa Nad, Jeremy Ecton, Hongxia Feng, Tarek A. Ibrahim +9 more | 2024-07-09 |