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Optical multichip package with multiple system-on-chip dies |
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| 12125777 |
Minimizing package impedance discontinuity through dielectric structure optimizations |
Zhiguo Qian, Gang Duan, Jieying Kong, Brandon C. Marin |
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| 12062616 |
Power delivery for embedded bridge die utilizing trench structures |
Zhiguo Qian, Jianyong Xie |
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| 12057413 |
Package design scheme for enabling high-speed low-loss signaling and mitigation of manufacturing risk and cost |
Lijiang Wang, Jianyong Xie, Arghya Sain, Xiaohong Jiang, Sujit Sharan |
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| 12009320 |
Interconnect loss of high density package with magnetic material |
Zhiguo Qian, Cemil Geyik, Jiwei Sun, Gang Duan |
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| 11983135 |
Electrical and optical interfaces at different heights along an edge of a package to increase bandwidth along the edge |
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| 11923308 |
Die interconnect structures having bump field and ground plane |
Zhiguo Qian |
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| 11903138 |
Fine feature formation techniques for printed circuit boards |
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| 11901280 |
Ground via clustering for crosstalk mitigation |
Zhiguo Qian, Yu Zhang |
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| 11887932 |
Dielectric-filled trench isolation of vias |
Zhiguo Qian, Jianyong Xie |
2024-01-30 |