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Modular periphery tile for integrated circuit device |
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Processor package with universal optical input/output |
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Techniques for clock signal transmission in integrated circuits and interposers |
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Low-latency optical connection for CXL for a server CPU |
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| 11983135 |
Electrical and optical interfaces at different heights along an edge of a package to increase bandwidth along the edge |
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Innovative interconnect design for package architecture to improve latency |
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Microelectronics assembly including top and bottom packages in stacked configuration with shared cooling |
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| 11901299 |
Interconnect architecture with silicon interposer and EMIB |
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