Issued Patents 2024
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183649 | IC package including multi-chip unit with bonded integrated heat spreader | Ravindranath V. Mahajan, Digvijay A. Raorane | 2024-12-31 |
| 12183596 | Low cost package warpage solution | Omkar G. Karhade, Nitin A. Deshpande, Bassam M. Ziadeh, Yoshihiro Tomita | 2024-12-31 |
| 12142568 | Multi-die ultrafine pitch patch architecture of interconnect bridge over glass layer and method of making | Sanka Ganesan, Kevin Thomas McCarthy, Leigh M. TRIBOLET, Ravindranath V. Mahajan, Robert L. Sankman | 2024-11-12 |
| 12142567 | Coreless architecture and processing strategy for EMIB-based substrates with high accuracy and high density | Xiao Di SUN ZHOU, Xiaoying Guo | 2024-11-12 |
| 12142545 | Nested architectures for enhanced heterogeneous integration | Ravindranath V. Mahajan, Sujit Sharan, Digvijay A. Raorane | 2024-11-12 |
| 12107042 | Localized high density substrate routing | Robert Starkston, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan | 2024-10-01 |
| 11984396 | Localized high density substrate routing | Robert Starkston, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan | 2024-05-14 |
| 11984377 | IC die and heat spreaders with solderable thermal interface structures for assemblies including solder array thermal interconnects | Je-Young Chang, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad | 2024-05-14 |
| 11978727 | Package on active silicon semiconductor packages | Wilfred Gomes, Sanka Ganesan, Doug B. Ingerly, Robert L. Sankman, Mark Bohr | 2024-05-07 |
| 11978685 | Glass core patch with in situ fabricated fan-out layer to enable die tiling applications | Srinivas V. Pietambaram, Robert L. Sankman, Rahul N. Manepalli, Gang Duan | 2024-05-07 |
| 11935808 | IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects | Je-Young Chang, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad | 2024-03-19 |
| 11923267 | IC die with solderable thermal interface structures for assemblies including solder array thermal interconnects | Je-Young Chang, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad | 2024-03-05 |
| 11908793 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Jiun Hann Sir, Poh Boon Khoo, Eng Huat Goh, Amruthavalli Pallavi Alur | 2024-02-20 |
| 11901299 | Interconnect architecture with silicon interposer and EMIB | MD Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Ravindranath V. Mahajan +7 more | 2024-02-13 |