| 12183649 |
IC package including multi-chip unit with bonded integrated heat spreader |
Ravindranath V. Mahajan, Digvijay A. Raorane |
2024-12-31 |
| 12183596 |
Low cost package warpage solution |
Omkar G. Karhade, Nitin A. Deshpande, Bassam M. Ziadeh, Yoshihiro Tomita |
2024-12-31 |
| 12142568 |
Multi-die ultrafine pitch patch architecture of interconnect bridge over glass layer and method of making |
Sanka Ganesan, Kevin Thomas McCarthy, Leigh M. TRIBOLET, Ravindranath V. Mahajan, Robert L. Sankman |
2024-11-12 |
| 12142567 |
Coreless architecture and processing strategy for EMIB-based substrates with high accuracy and high density |
Xiao Di SUN ZHOU, Xiaoying Guo |
2024-11-12 |
| 12142545 |
Nested architectures for enhanced heterogeneous integration |
Ravindranath V. Mahajan, Sujit Sharan, Digvijay A. Raorane |
2024-11-12 |
| 12107042 |
Localized high density substrate routing |
Robert Starkston, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan |
2024-10-01 |
| 11984396 |
Localized high density substrate routing |
Robert Starkston, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan |
2024-05-14 |
| 11984377 |
IC die and heat spreaders with solderable thermal interface structures for assemblies including solder array thermal interconnects |
Je-Young Chang, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad |
2024-05-14 |
| 11978727 |
Package on active silicon semiconductor packages |
Wilfred Gomes, Sanka Ganesan, Doug B. Ingerly, Robert L. Sankman, Mark Bohr |
2024-05-07 |
| 11978685 |
Glass core patch with in situ fabricated fan-out layer to enable die tiling applications |
Srinivas V. Pietambaram, Robert L. Sankman, Rahul N. Manepalli, Gang Duan |
2024-05-07 |
| 11935808 |
IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects |
Je-Young Chang, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad |
2024-03-19 |
| 11923267 |
IC die with solderable thermal interface structures for assemblies including solder array thermal interconnects |
Je-Young Chang, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad |
2024-03-05 |
| 11908793 |
Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge |
Jiun Hann Sir, Poh Boon Khoo, Eng Huat Goh, Amruthavalli Pallavi Alur |
2024-02-20 |
| 11901299 |
Interconnect architecture with silicon interposer and EMIB |
MD Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Ravindranath V. Mahajan +7 more |
2024-02-13 |