| 12176147 |
Three-dimensional capacitors with double metal electrodes |
James Waldemer, Matthieu Giraud-Carrier, Bernhard Sell, Travis W. Lajoie, Abhishek A. Sharma |
2024-12-24 |
| 12170273 |
Integrated circuit assemblies with direct chip attach to circuit boards |
Sanka Ganesan, Abhishek A. Sharma, Doug B. Ingerly, Mauro J. Kobrinsky, Kevin J. Fischer |
2024-12-17 |
| 12148747 |
Gallium nitride (GAN) three-dimensional integrated circuit technology |
Han Wui Then, Marko Radosavljevic, Pratik KOIRALA, Nicole K. Thomas, Paul B. Fischer +5 more |
2024-11-19 |
| 12147083 |
Hybrid manufacturing for integrating photonic and electronic components |
Abhishek A. Sharma, Mauro J. Kobrinsky |
2024-11-19 |
| 12120865 |
Arrays of double-sided dram cells including capacitors on the frontside and backside of a stacked transistor structure |
Cheng-Ying Huang, Ashish Agrawal, Gilbert Dewey, Abhishek A. Sharma, Jack T. Kavalieros |
2024-10-15 |
| 12114479 |
Three-dimensional memory arrays with layer selector transistors |
Mauro J. Kobrinsky, Abhishek A. Sharma, Rajesh Kumar, Kinyip Phoa, Elliot N. Tan +2 more |
2024-10-08 |
| 12074138 |
Hyperchip |
Mark Bohr, Rajesh Kumar, Pooya Tadayon, Doug B. Ingerly |
2024-08-27 |
| 12058849 |
Three-dimensional nanoribbon-based dynamic random-access memory |
Kinyip Phoa, Mauro J. Kobrinsky, Tahir Ghani, Uygar E. Avci, Rajesh Kumar |
2024-08-06 |
| 11984430 |
Hyperchip |
Mark Bohr, Rajesh Kumar, Pooya Tadayon, Doug B. Ingerly |
2024-05-14 |
| 11978727 |
Package on active silicon semiconductor packages |
Sanka Ganesan, Doug B. Ingerly, Robert L. Sankman, Mark Bohr, Debendra Mallik |
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| 11901347 |
Microelectronic package with three-dimensional (3D) monolithic memory die |
Mauro J. Kobrinsky, Doug B. Ingerly, Tahir Ghani |
2024-02-13 |
| 11894359 |
Distributed semiconductor die and package architecture |
Mark Bohr, Rajesh Kumar, Robert L. Sankman, Ravindranath V. Mahajan, Wesley McCullough |
2024-02-06 |