Issued Patents 2024
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176147 | Three-dimensional capacitors with double metal electrodes | James Waldemer, Matthieu Giraud-Carrier, Bernhard Sell, Travis W. Lajoie, Abhishek A. Sharma | 2024-12-24 |
| 12170273 | Integrated circuit assemblies with direct chip attach to circuit boards | Sanka Ganesan, Abhishek A. Sharma, Doug B. Ingerly, Mauro J. Kobrinsky, Kevin J. Fischer | 2024-12-17 |
| 12148747 | Gallium nitride (GAN) three-dimensional integrated circuit technology | Han Wui Then, Marko Radosavljevic, Pratik KOIRALA, Nicole K. Thomas, Paul B. Fischer +5 more | 2024-11-19 |
| 12147083 | Hybrid manufacturing for integrating photonic and electronic components | Abhishek A. Sharma, Mauro J. Kobrinsky | 2024-11-19 |
| 12120865 | Arrays of double-sided dram cells including capacitors on the frontside and backside of a stacked transistor structure | Cheng-Ying Huang, Ashish Agrawal, Gilbert Dewey, Abhishek A. Sharma, Jack T. Kavalieros | 2024-10-15 |
| 12114479 | Three-dimensional memory arrays with layer selector transistors | Mauro J. Kobrinsky, Abhishek A. Sharma, Rajesh Kumar, Kinyip Phoa, Elliot N. Tan +2 more | 2024-10-08 |
| 12074138 | Hyperchip | Mark Bohr, Rajesh Kumar, Pooya Tadayon, Doug B. Ingerly | 2024-08-27 |
| 12058849 | Three-dimensional nanoribbon-based dynamic random-access memory | Kinyip Phoa, Mauro J. Kobrinsky, Tahir Ghani, Uygar E. Avci, Rajesh Kumar | 2024-08-06 |
| 11984430 | Hyperchip | Mark Bohr, Rajesh Kumar, Pooya Tadayon, Doug B. Ingerly | 2024-05-14 |
| 11978727 | Package on active silicon semiconductor packages | Sanka Ganesan, Doug B. Ingerly, Robert L. Sankman, Mark Bohr, Debendra Mallik | 2024-05-07 |
| 11901347 | Microelectronic package with three-dimensional (3D) monolithic memory die | Mauro J. Kobrinsky, Doug B. Ingerly, Tahir Ghani | 2024-02-13 |
| 11894359 | Distributed semiconductor die and package architecture | Mark Bohr, Rajesh Kumar, Robert L. Sankman, Ravindranath V. Mahajan, Wesley McCullough | 2024-02-06 |