| 12170273 |
Integrated circuit assemblies with direct chip attach to circuit boards |
Wilfred Gomes, Sanka Ganesan, Abhishek A. Sharma, Doug B. Ingerly, Kevin J. Fischer |
2024-12-17 |
| 12148751 |
Use of a placeholder for backside contact formation for transistor arrangements |
Andy Wei, Anand S. Murthy, Guillaume Bouche |
2024-11-19 |
| 12147083 |
Hybrid manufacturing for integrating photonic and electronic components |
Abhishek A. Sharma, Wilfred Gomes |
2024-11-19 |
| 12114479 |
Three-dimensional memory arrays with layer selector transistors |
Wilfred Gomes, Abhishek A. Sharma, Rajesh Kumar, Kinyip Phoa, Elliot N. Tan +2 more |
2024-10-08 |
| 12107170 |
Transistor channel passivation with 2D crystalline material |
Carl Naylor, Abhishek A. Sharma, Christopher J. Jezewski, Urusa Alaan, Justin R. Weber |
2024-10-01 |
| 12100705 |
Deep trench via for three-dimensional integrated circuit |
Yih Wang, Rishabh Mehandru, Tahir Ghani, Mark Bohr, Marni Nabors |
2024-09-24 |
| 12058849 |
Three-dimensional nanoribbon-based dynamic random-access memory |
Wilfred Gomes, Kinyip Phoa, Tahir Ghani, Uygar E. Avci, Rajesh Kumar |
2024-08-06 |
| 11996362 |
Integrated circuit device with crenellated metal trace layout |
Patrick Morrow, Mark Bohr, Tahir Ghani, Rishabh Mehandru, Ranjith Kumar |
2024-05-28 |
| 11985909 |
Fabrication of stackable embedded eDRAM using a binary alloy based on antimony |
Elijah V. Karpov |
2024-05-14 |
| 11948874 |
Vertically spaced intra-level interconnect line metallization for integrated circuit devices |
Kevin Lin, Sukru YEMENICIOGLU, Patrick Morrow, Richard E. Schenker |
2024-04-02 |
| 11901347 |
Microelectronic package with three-dimensional (3D) monolithic memory die |
Wilfred Gomes, Doug B. Ingerly, Tahir Ghani |
2024-02-13 |
| 11881452 |
Device layer interconnects |
Mark Bohr, Marni Nabors |
2024-01-23 |