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Selective metal removal for conductive interconnects in integrated circuitry |
Rahim Kasim, Manish Chandhok, Florian Gstrein |
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Inductor/core assemblies for integrated circuits |
Nicholas James Harold McKubre, Han Wui Then |
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| 12119409 |
Multi-layer crystalline back gated thin film transistor |
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| 12107044 |
Metal oxycarbide resists as leave behind plugs |
Marie Krysak, Robert L. Bristol, Charles H. Wallace |
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| 12027458 |
Subtractively patterned interconnect structures for integrated circuits |
Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski, Jiun-Ruey Chen +10 more |
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| 12002754 |
Multi-height and multi-width interconnect line metallization for integrated circuit structures |
Hui Jae Yoo |
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| 11990403 |
Dielectric helmet-based approaches for back end of line (BEOL) interconnect fabrication and structures resulting therefrom |
Richard E. Schenker, Jeffery D. Bielefeld, Rami Hourani, Manish Chandhok |
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| 11955377 |
Differential hardmasks for modulation of electrobucket sensitivity |
Robert L. Bristol, James M. Blackwell, Rami Hourani, Marie Krysak |
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| 11953826 |
Lined photobucket structure for back end of line (BEOL) interconnect formation |
James M. Blackwell, Robert L. Bristol, Marie Krysak, Florian Gstrein, Eungnak Han +2 more |
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| 11948874 |
Vertically spaced intra-level interconnect line metallization for integrated circuit devices |
Sukru YEMENICIOGLU, Patrick Morrow, Richard E. Schenker, Mauro J. Kobrinsky |
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| 11894270 |
Grating replication using helmets and topographically-selective deposition |
Sudipto Naskar, Manish Chandhok, Miriam Reshotko, Rami Hourani |
2024-02-06 |
| 11888034 |
Transistors with metal chalcogenide channel materials |
Abhishek A. Sharma, Ashish Agarwal, Urusa Alaan, Christopher J. Jezewski, Carl Naylor |
2024-01-30 |