Issued Patents 2024
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170319 | Dual contact process with stacked metal layers | Kevin T. Cook, Anand S. Murthy, Gilbert Dewey, Nazila Haratipour, Ralph T. Troeger +1 more | 2024-12-17 |
| 12165917 | Integrated circuit interconnect structures with ultra-thin metal chalcogenide barrier materials | Carl Naylor | 2024-12-10 |
| 12107085 | Interconnect techniques for electrically connecting source/drain regions of stacked transistors | Aaron D. Lilak, Gilbert Dewey, Cheng-Ying Huang, Ehren Mannebach, Rishabh Mehandru +4 more | 2024-10-01 |
| 12107170 | Transistor channel passivation with 2D crystalline material | Carl Naylor, Abhishek A. Sharma, Mauro J. Kobrinsky, Urusa Alaan, Justin R. Weber | 2024-10-01 |
| 12033896 | Isolation wall stressor structures to improve channel stress and their methods of fabrication | Aaron D. Lilak, Willy Rachmady, Rishabh Mehandru, Gilbert Dewey, Anh Phan | 2024-07-09 |
| 12027458 | Subtractively patterned interconnect structures for integrated circuits | Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Jiun-Ruey Chen +10 more | 2024-07-02 |
| 11888034 | Transistors with metal chalcogenide channel materials | Abhishek A. Sharma, Ashish Agarwal, Urusa Alaan, Kevin Lin, Carl Naylor | 2024-01-30 |
| 11869894 | Metallization structures for stacked device connectivity and their methods of fabrication | Aaron D. Lilak, Anh Phan, Patrick Morrow, Willy Rachmady, Gilbert Dewey +6 more | 2024-01-09 |
| 11862563 | Cobalt based interconnects and methods of fabrication thereof | Tejaswi K. Indukuri, Ramanan V. Chebiam, Colin T. Carver | 2024-01-02 |