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Anh Phan — 11 Patents in 2024

Intel: 11 patents #119 of 4,430Top 3%

Beaverton, OR: #20 of 530 inventorsTop 4%

Oregon: #135 of 4,306 inventorsTop 4%

Overall (2024): #8,300 of 561,600Top 2%

11 Patents 2024

Issued Patents 2024

Showing 1–11 of 11 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12148806	Stacked source-drain-gate connection and process for forming such	Ehren Mannebach, Aaron D. Lilak, Hui Jae Yoo, Patrick Morrow, Willy Rachmady +2 more	2024-11-19	$25,575,000
12107085	Interconnect techniques for electrically connecting source/drain regions of stacked transistors	Aaron D. Lilak, Gilbert Dewey, Cheng-Ying Huang, Christopher J. Jezewski, Ehren Mannebach +4 more	2024-10-01	$20,560,000
12080605	Backside contacts for semiconductor devices	Aaron D. Lilak, Ehren Mannebach, Richard E. Schenker, Stephanie A. Bojarski, Willy Rachmady +4 more	2024-09-03	$14,017,000
12033896	Isolation wall stressor structures to improve channel stress and their methods of fabrication	Aaron D. Lilak, Christopher J. Jezewski, Willy Rachmady, Rishabh Mehandru, Gilbert Dewey	2024-07-09	$24,938,000
12020929	Epitaxial layer with substantially parallel sides	Cheng-Ying Huang, Gilbert Dewey, Jack T. Kavalieros, Aaron D. Lilak, Ehren Mannebach +3 more	2024-06-25	$22,163,000
11996411	Stacked forksheet transistors	Cheng-Ying Huang, Gilbert Dewey, Nicole K. Thomas, Urusa Alaan, Seung Hoon Sung +8 more	2024-05-28	$30,739,000
11996408	Leave-behind protective layer having secondary purpose	Aaron D. Lilak, Ehren Mannebach, Cheng-Ying Huang, Stephanie A. Bojarski, Gilbert Dewey +2 more	2024-05-28	$30,739,000
11942416	Sideways vias in isolation areas to contact interior layers in stacked devices	Ehren Mannebach, Aaron D. Lilak, Hui Jae Yoo, Patrick Morrow, Willy Rachmady +3 more	2024-03-26	$33,708,000
11916118	Stacked source-drain-gate connection and process for forming such	Ehren Mannebach, Aaron D. Lilak, Hui Jae Yoo, Patrick Morrow, Willy Rachmady +2 more	2024-02-27	$28,450,000
11894372	Stacked trigate transistors with dielectric isolation and process for forming such	Willy Rachmady, Cheng-Ying Huang, Gilbert Dewey, Aaron D. Lilak, Patrick Morrow +2 more	2024-02-06	$35,892,000
11869894	Metallization structures for stacked device connectivity and their methods of fabrication	Aaron D. Lilak, Patrick Morrow, Willy Rachmady, Gilbert Dewey, Jessica M. Torres +6 more	2024-01-09	$30,329,000