| 12176323 |
Microelectronic assemblies |
Adel A. Elsherbini, Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan +3 more |
2024-12-24 |
| 12148806 |
Stacked source-drain-gate connection and process for forming such |
Ehren Mannebach, Aaron D. Lilak, Hui Jae Yoo, Anh Phan, Willy Rachmady +2 more |
2024-11-19 |
| 12107085 |
Interconnect techniques for electrically connecting source/drain regions of stacked transistors |
Aaron D. Lilak, Gilbert Dewey, Cheng-Ying Huang, Christopher J. Jezewski, Ehren Mannebach +4 more |
2024-10-01 |
| 12100623 |
Vertically stacked finFETs and shared gate patterning |
Aaron D. Lilak, Sean T. Ma, Justin R. Weber, Rishabh Mehandru, Stephen M. Cea +1 more |
2024-09-24 |
| 12100762 |
Wrap-around source/drain method of making contacts for backside metals |
Kimin Jun, Il-Seok Son, Donald W. Nelson |
2024-09-24 |
| 12100761 |
Wrap-around source/drain method of making contacts for backside metals |
Kimin Jun, Il-Seok Son, Donald W. Nelson |
2024-09-24 |
| 12080605 |
Backside contacts for semiconductor devices |
Aaron D. Lilak, Ehren Mannebach, Anh Phan, Richard E. Schenker, Stephanie A. Bojarski +4 more |
2024-09-03 |
| 12057494 |
Stacked transistors |
Rishabh Mehandru, Aaron D. Lilak |
2024-08-06 |
| 12051723 |
PN-body-tied field effect transistors |
Aaron D. Lilak, Kerryann Marrietta Foley, Sayed Hasan, Willy Rachmady |
2024-07-30 |
| 12020929 |
Epitaxial layer with substantially parallel sides |
Cheng-Ying Huang, Gilbert Dewey, Jack T. Kavalieros, Aaron D. Lilak, Ehren Mannebach +3 more |
2024-06-25 |
| 11996362 |
Integrated circuit device with crenellated metal trace layout |
Mauro J. Kobrinsky, Mark Bohr, Tahir Ghani, Rishabh Mehandru, Ranjith Kumar |
2024-05-28 |
| 11996411 |
Stacked forksheet transistors |
Cheng-Ying Huang, Gilbert Dewey, Anh Phan, Nicole K. Thomas, Urusa Alaan +8 more |
2024-05-28 |
| 11990899 |
Multi-level spin logic |
Sasikanth Manipatruni, Ian A. Young, Dmitri E. Nikonov, Uygar E. Avci, Anurag Chaudhry |
2024-05-21 |
| 11948874 |
Vertically spaced intra-level interconnect line metallization for integrated circuit devices |
Kevin Lin, Sukru YEMENICIOGLU, Richard E. Schenker, Mauro J. Kobrinsky |
2024-04-02 |
| 11948831 |
Apparatus with multi-wafer based device and method for forming such |
Anup Pancholi, Prashant Majhi, Paul B. Fischer |
2024-04-02 |
| 11942416 |
Sideways vias in isolation areas to contact interior layers in stacked devices |
Ehren Mannebach, Aaron D. Lilak, Hui Jae Yoo, Anh Phan, Willy Rachmady +3 more |
2024-03-26 |
| 11942526 |
Integrated circuit contact structures |
Glenn A. Glass, Anand S. Murthy, Rishabh Mehandru |
2024-03-26 |
| 11935891 |
Non-silicon N-type and P-type stacked transistors for integrated circuit devices |
Gilbert Dewey, Ravi Pillarisetty, Rishabh Mehandru, Cheng-Ying Huang, Willy Rachmady +1 more |
2024-03-19 |
| 11935933 |
Backside contact structures and fabrication for metal on both sides of devices |
Rishabh Mehandru, Aaron D. Lilak, Kimin Jun |
2024-03-19 |
| 11916118 |
Stacked source-drain-gate connection and process for forming such |
Ehren Mannebach, Aaron D. Lilak, Hui Jae Yoo, Anh Phan, Willy Rachmady +2 more |
2024-02-27 |
| 11894262 |
Back side processing of integrated circuit structures to form insulation structure between adjacent transistor structures |
Aaron D. Lilak, Rishabh Mehandru |
2024-02-06 |
| 11894372 |
Stacked trigate transistors with dielectric isolation and process for forming such |
Willy Rachmady, Cheng-Ying Huang, Gilbert Dewey, Aaron D. Lilak, Anh Phan +2 more |
2024-02-06 |
| 11869894 |
Metallization structures for stacked device connectivity and their methods of fabrication |
Aaron D. Lilak, Anh Phan, Willy Rachmady, Gilbert Dewey, Jessica M. Torres +6 more |
2024-01-09 |