| 12183961 |
Methods for conductively coating millimeter waveguides |
Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Sasha N. Oster, Adel A. Elsherbini +3 more |
2024-12-31 |
| 12176323 |
Microelectronic assemblies |
Adel A. Elsherbini, Henning Braunisch, Aleksandar Aleksov, Johanna M. Swan, Patrick Morrow +3 more |
2024-12-24 |
| 12165962 |
Hermetic sealing structures in microelectronic assemblies having direct bonding |
Aleksandar Aleksov, Mohammad Enamul Kabir, Adel A. Elsherbini, Johanna M. Swan, Feras Eid |
2024-12-10 |
| 12142510 |
Carrier for microelectronic assemblies having direct bonding |
Johanna M. Swan, Adel A. Elsherbini, Michael Baker, Aleksandar Aleksov, Feras Eid |
2024-11-12 |
| 12119317 |
Singulation of microelectronic components with direct bonding interfaces |
Bhaskar Jyoti Krishnatreya, Nagatoshi Tsunoda, Sairam Agraharam |
2024-10-15 |
| 12113048 |
Microelectronic assemblies |
Adel A. Elsherbini, Feras Eid, Johanna M. Swan |
2024-10-08 |
| 12107060 |
Microelectronic assemblies with inductors in direct bonding regions |
Adel A. Elsherbini, Zhiguo Qian, Gerald Pasdast, Mohammad Enamul Kabir, Han Wui Then +5 more |
2024-10-01 |
| 12080652 |
Microelectronic assemblies with communication networks |
Adel A. Elsherbini, Amr Elshazly, Arun Chandrasekhar, Johanna M. Swan |
2024-09-03 |
| 12062631 |
Microelectronic assemblies with inductors in direct bonding regions |
Adel A. Elsherbini, Krishna Bharath, Kevin P. O'Brien, Kimin Jun, Han Wui Then +5 more |
2024-08-13 |
| 12057402 |
Direct bonding in microelectronic assemblies |
Aleksandar Aleksov, Adel A. Elsherbini, Johanna M. Swan, Feras Eid, Randy B. Osborne +1 more |
2024-08-06 |
| 12014990 |
Composite interposer structure and method of providing same |
Adel A. Elsherbini, Johanna M. Swan, Gerald Pasdast |
2024-06-18 |
| 11990448 |
Direct bonding in microelectronic assemblies |
Feras Eid, Adel A. Elsherbini, Aleksandar Aleksov, Johanna M. Swan |
2024-05-21 |
| 11984439 |
Microelectronic assemblies |
Adel A. Elsherbini, Georgios Dogiamis, Zhiguo Qian, Johanna M. Swan |
2024-05-14 |
| 11967580 |
Microelectronic assemblies with communication networks |
Adel A. Elsherbini, Amr Elshazly, Arun Chandrasekhar, Johanna M. Swan |
2024-04-23 |
| 11955434 |
Ultra small molded module integrated with die by module-on-wafer assembly |
Yoshihiro Tomita, Eric J. Li, Javier A. Falcon, Joshua D. Heppner |
2024-04-09 |
| 11916006 |
Microelectronic assemblies having an integrated voltage regulator chiplet |
Adel A. Elsherbini, Kaladhar Radhakrishnan, Krishna Bharath, Johanna M. Swan |
2024-02-27 |
| 11916020 |
Microelectronic assemblies with communication networks |
Adel A. Elsherbini, Amr Elshazly, Arun Chandrasekhar, Johanna M. Swan |
2024-02-27 |
| 11901330 |
Microelectronic assemblies |
Adel A. Elsherbini, Johanna M. Swan, Arun Chandrasekhar |
2024-02-13 |
| 11881457 |
Semiconductor packaging with high density interconnects |
Adel A. Elsherbini, Johanna M. Swan, Henning Braunisch, Krishna Bharath, Javier Soto Gonzalez +1 more |
2024-01-23 |
| 11870163 |
Antenna package using ball attach array to connect antenna and base substrates |
Jimin Yao, Robert L. Sankman, Sri Chaitra Jyotsna Chavali, William J. Lambert, Zhichao Zhang |
2024-01-09 |