Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955434 | Ultra small molded module integrated with die by module-on-wafer assembly | Yoshihiro Tomita, Shawna M. Liff, Javier A. Falcon, Joshua D. Heppner | 2024-04-09 |
| 11903138 | Fine feature formation techniques for printed circuit boards | Kemal Aygun, Kai Xiao, Gong Ouyang, Zhichao Zhang | 2024-02-13 |