Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955434 | Ultra small molded module integrated with die by module-on-wafer assembly | Yoshihiro Tomita, Eric J. Li, Shawna M. Liff, Joshua D. Heppner | 2024-04-09 |
| 11881457 | Semiconductor packaging with high density interconnects | Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Henning Braunisch, Krishna Bharath +1 more | 2024-01-23 |