Issued Patents 2024
Showing 25 most recent of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183961 | Methods for conductively coating millimeter waveguides | Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Sasha N. Oster, Shawna M. Liff +3 more | 2024-12-31 |
| 12176323 | Microelectronic assemblies | Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan, Patrick Morrow +3 more | 2024-12-24 |
| 12170244 | High-throughput additively manufactured power delivery vias and traces | Feras Eid, Georgios Dogiamis, Henning Braunisch, Beomseok Choi, William J. Lambert +3 more | 2024-12-17 |
| 12165962 | Hermetic sealing structures in microelectronic assemblies having direct bonding | Aleksandar Aleksov, Mohammad Enamul Kabir, Shawna M. Liff, Johanna M. Swan, Feras Eid | 2024-12-10 |
| 12148747 | Gallium nitride (GAN) three-dimensional integrated circuit technology | Han Wui Then, Marko Radosavljevic, Pratik KOIRALA, Nicole K. Thomas, Paul B. Fischer +5 more | 2024-11-19 |
| 12150271 | Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device | Telesphor Kamgaing, Johanna M. Swan, Georgios Dogiamis, Henning Braunisch, Aleksandar Aleksov +1 more | 2024-11-19 |
| 12142510 | Carrier for microelectronic assemblies having direct bonding | Shawna M. Liff, Johanna M. Swan, Michael Baker, Aleksandar Aleksov, Feras Eid | 2024-11-12 |
| 12142543 | Thermal management solutions for embedded integrated circuit devices | Johanna M. Swan, Feras Eid | 2024-11-12 |
| 12113048 | Microelectronic assemblies | Feras Eid, Johanna M. Swan, Shawna M. Liff | 2024-10-08 |
| 12107060 | Microelectronic assemblies with inductors in direct bonding regions | Zhiguo Qian, Gerald Pasdast, Mohammad Enamul Kabir, Han Wui Then, Kimin Jun +5 more | 2024-10-01 |
| 12100541 | Embedded cooling channel in magnetics | Beomseok Choi | 2024-09-24 |
| 12087682 | Power delivery structures | Feras Eid, Georgios Dogiamis, Beomseok Choi, Henning Braunisch, William J. Lambert +2 more | 2024-09-10 |
| 12080652 | Microelectronic assemblies with communication networks | Amr Elshazly, Arun Chandrasekhar, Shawna M. Liff, Johanna M. Swan | 2024-09-03 |
| 12062631 | Microelectronic assemblies with inductors in direct bonding regions | Krishna Bharath, Kevin P. O'Brien, Kimin Jun, Han Wui Then, Mohammad Enamul Kabir +5 more | 2024-08-13 |
| 12057402 | Direct bonding in microelectronic assemblies | Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan, Feras Eid, Randy B. Osborne +1 more | 2024-08-06 |
| 12040307 | Magnetic induced heating for solder interconnects | Feras Eid, Georgios Dogiamis | 2024-07-16 |
| 12014990 | Composite interposer structure and method of providing same | Shawna M. Liff, Johanna M. Swan, Gerald Pasdast | 2024-06-18 |
| 12002745 | High performance integrated RF passives using dual lithography process | Mathew J. Manusharow, Krishna Bharath, William J. Lambert, Robert L. Sankman, Aleksandar Aleksov +6 more | 2024-06-04 |
| 11990448 | Direct bonding in microelectronic assemblies | Feras Eid, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan | 2024-05-21 |
| 11990419 | Physically unclonable function circuitry of a package substrate and method of providing same | Georgios Dogiamis, Feras Eid, David Johnston, Jyothi Bhaskarr Velamala, Rachael Parker | 2024-05-21 |
| 11984439 | Microelectronic assemblies | Georgios Dogiamis, Shawna M. Liff, Zhiguo Qian, Johanna M. Swan | 2024-05-14 |
| 11967580 | Microelectronic assemblies with communication networks | Amr Elshazly, Arun Chandrasekhar, Shawna M. Liff, Johanna M. Swan | 2024-04-23 |
| 11933555 | Heat dissipation device having anisotropic thermally conductive sections and isotropic thermally conductive sections | Feras Eid, Johanna M. Swan | 2024-03-19 |
| 11916006 | Microelectronic assemblies having an integrated voltage regulator chiplet | Kaladhar Radhakrishnan, Krishna Bharath, Shawna M. Liff, Johanna M. Swan | 2024-02-27 |
| 11916020 | Microelectronic assemblies with communication networks | Amr Elshazly, Arun Chandrasekhar, Shawna M. Liff, Johanna M. Swan | 2024-02-27 |