Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094827 | Size and efficiency of dies | Jonathan Rosenfeld | 2024-09-17 |
| 12094831 | High density interconnect device and method | Mihir K. Roy | 2024-09-17 |
| 12051651 | Size and efficiency of dies | Jonathan Rosenfeld | 2024-07-30 |
| 12002745 | High performance integrated RF passives using dual lithography process | Adel A. Elsherbini, Krishna Bharath, William J. Lambert, Robert L. Sankman, Aleksandar Aleksov +6 more | 2024-06-04 |
| 11961804 | Size and efficiency of dies | Jonathan Rosenfeld | 2024-04-16 |