Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094831 | High density interconnect device and method | Mathew J. Manusharow | 2024-09-17 |
| 12087656 | Package architecture utilizing wafer to wafer bonding | Anthony M. Chiu, Robert Charles Dry | 2024-09-10 |
| 12002762 | High density organic bridge device and method | Stefanie M. Lotz, Wei-Lun Kane Jen | 2024-06-04 |
| 11942391 | System in package with flip chip die over multi-layer heatsink stanchion | Kelly M. Lear, Jeffrey Miller, Christine Blair | 2024-03-26 |