Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087656 | Package architecture utilizing wafer to wafer bonding | Robert Charles Dry, Mihir K. Roy | 2024-09-10 |
| 11948893 | Electronic component with lid to manage radiation feedback | Zhunming Du, Christopher Sanabria, Timothy M. Gittemeier, Terry Hon, Tariq Lodhi | 2024-04-02 |