Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087656 | Package architecture utilizing wafer to wafer bonding | Anthony M. Chiu, Mihir K. Roy | 2024-09-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087656 | Package architecture utilizing wafer to wafer bonding | Anthony M. Chiu, Mihir K. Roy | 2024-09-10 |