Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136615 | Electronic package with interposer between integrated circuit dies | Matthew Essar, Curtis Miller, Zhunming Du | 2024-11-05 |
| 11948893 | Electronic component with lid to manage radiation feedback | Zhunming Du, Timothy M. Gittemeier, Terry Hon, Anthony M. Chiu, Tariq Lodhi | 2024-04-02 |