Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136615 | Electronic package with interposer between integrated circuit dies | Curtis Miller, Christopher Sanabria, Zhunming Du | 2024-11-05 |
| 11877505 | Fluorinated polymers with low dielectric loss for environmental protection in semiconductor devices | Christo Bojkov, Michael Roberg, Walid M. Meliane, Terry Hon | 2024-01-16 |