Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11942391 | System in package with flip chip die over multi-layer heatsink stanchion | Jeffrey Miller, Mihir K. Roy, Christine Blair | 2024-03-26 |
| 11923827 | Bulk acoustic wave resonator stacked onto an integrated passive device | Jeffery Galipeau | 2024-03-05 |