Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11942391 | System in package with flip chip die over multi-layer heatsink stanchion | Kelly M. Lear, Jeffrey Miller, Mihir K. Roy | 2024-03-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11942391 | System in package with flip chip die over multi-layer heatsink stanchion | Kelly M. Lear, Jeffrey Miller, Mihir K. Roy | 2024-03-26 |