Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12113026 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Johanna M. Swan +1 more | 2024-10-08 |
| 12002762 | High density organic bridge device and method | Mihir K. Roy, Wei-Lun Kane Jen | 2024-06-04 |
| 11876053 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Johanna M. Swan +1 more | 2024-01-16 |