| 12183961 |
Methods for conductively coating millimeter waveguides |
Aleksandar Aleksov, Telesphor Kamgaing, Sasha N. Oster, Adel A. Elsherbini, Shawna M. Liff +3 more |
2024-12-31 |
| 12170244 |
High-throughput additively manufactured power delivery vias and traces |
Adel A. Elsherbini, Feras Eid, Henning Braunisch, Beomseok Choi, William J. Lambert +3 more |
2024-12-17 |
| 12166261 |
Components for millimeter-wave communication |
Diego Correas-Serrano, Henning Braunisch, Neelam Prabhu Gaunkar, Telesphor Kamgaing |
2024-12-10 |
| 12155372 |
Multi-filter die |
Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Johanna M. Swan |
2024-11-26 |
| 12155133 |
Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems |
Feras Eid, Sasha N. Oster, Telesphor Kamgaing, Aleksandar Aleksov |
2024-11-26 |
| 12150271 |
Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device |
Telesphor Kamgaing, Johanna M. Swan, Henning Braunisch, Adel A. Elsherbini, Aleksandar Aleksov +1 more |
2024-11-19 |
| 12126067 |
Millimeter-wave dielectric waveguide including an opening of varying cross-section enclosed within a first material and the first material surrounded by a second material |
Diego Correas-Serrano, Henning Braunisch, Neelam Prabhu Gaunkar, Telesphor Kamgaing |
2024-10-22 |
| 12126068 |
Millimeter-wave dielectric waveguide bundle including first and second adjacent dielectric waveguides having different core and/or cladding materials |
Diego Correas-Serrano, Henning Braunisch, Neelam Prabhu Gaunkar, Telesphor Kamgaing |
2024-10-22 |
| 12107314 |
Microelectronic support for millimeter-wave communication including a transmission line trace and via pad spaced apart from a respective anti-trace and anti-pad |
Neelam Prabhu Gaunkar, Telesphor Kamgaing, Henning Braunisch, Diego Correas-Serrano |
2024-10-01 |
| 12087682 |
Power delivery structures |
Adel A. Elsherbini, Feras Eid, Beomseok Choi, Henning Braunisch, William J. Lambert +2 more |
2024-09-10 |
| 12088360 |
Dispersive waveguide crosstalk mitigation |
Henning Braunisch, Diego Correas-Serrano, Neelam Prabhu Gaunkar, Telesphor Kamgaing, Cooper S. Levy +2 more |
2024-09-10 |
| 12040776 |
Integrated radio frequency (RF) front-end module (FEM) |
Telesphor Kamgaing, Aleksandar Aleksov, Feras Eid, Johanna M. Swan |
2024-07-16 |
| 12040307 |
Magnetic induced heating for solder interconnects |
Feras Eid, Adel A. Elsherbini |
2024-07-16 |
| 12021289 |
Components for millimeter-wave communication |
Diego Correas-Serrano, Henning Braunisch, Neelam Prabhu Gaunkar, Telesphor Kamgaing |
2024-06-25 |
| 12007170 |
Thermal management in integrated circuit packages |
Feras Eid, Telesphor Kamgaing, Aleksandar Aleksov, Johanna M. Swan |
2024-06-11 |
| 11990419 |
Physically unclonable function circuitry of a package substrate and method of providing same |
Feras Eid, Adel A. Elsherbini, David Johnston, Jyothi Bhaskarr Velamala, Rachael Parker |
2024-05-21 |
| 11984439 |
Microelectronic assemblies |
Adel A. Elsherbini, Shawna M. Liff, Zhiguo Qian, Johanna M. Swan |
2024-05-14 |
| 11955684 |
Components for millimeter-wave communication |
Diego Correas-Serrano, Henning Braunisch, Neelam Prabhu Gaunkar, Telesphor Kamgaing |
2024-04-09 |
| 11916604 |
Dispersion compensation for electromagnetic waveguides |
Diego Correas-Serrano, Henning Braunisch, Neelam Prabhu Gaunkar, Telesphor Kamgaing, Thomas W. Brown +1 more |
2024-02-27 |
| 11895815 |
Additive manufacturing for integrated circuit assembly cables |
Adel A. Elsherbini, Feras Eid |
2024-02-06 |
| 11887944 |
Additive manufacturing for integrated circuit assembly connectors |
Feras Eid, Adel A. Elsherbini |
2024-01-30 |