Issued Patents 2024
Showing 26–31 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11908802 | Multi-chip package with high density interconnects | Aleksandar Aleksov, Kristof Darmawikarta, Robert Alan May, Sri Ranga Sai Boyapati | 2024-02-20 |
| 11901330 | Microelectronic assemblies | Shawna M. Liff, Johanna M. Swan, Arun Chandrasekhar | 2024-02-13 |
| 11895815 | Additive manufacturing for integrated circuit assembly cables | Georgios Dogiamis, Feras Eid | 2024-02-06 |
| 11887944 | Additive manufacturing for integrated circuit assembly connectors | Georgios Dogiamis, Feras Eid | 2024-01-30 |
| 11887946 | Semiconductor packages with antennas | Telesphor Kamgaing, Sasha N. Oster | 2024-01-30 |
| 11881457 | Semiconductor packaging with high density interconnects | Johanna M. Swan, Shawna M. Liff, Henning Braunisch, Krishna Bharath, Javier Soto Gonzalez +1 more | 2024-01-23 |