Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955434 | Ultra small molded module integrated with die by module-on-wafer assembly | Yoshihiro Tomita, Eric J. Li, Shawna M. Liff, Javier A. Falcon | 2024-04-09 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955434 | Ultra small molded module integrated with die by module-on-wafer assembly | Yoshihiro Tomita, Eric J. Li, Shawna M. Liff, Javier A. Falcon | 2024-04-09 |